Originally posted by
krishnaprasad mbsir ,
i have another doubt about core prepreg,plane layer totally confusing this .what is the deffrent requirement for these ?
You need to dig into technology a bit first.
Rigid PCB may have back-drill feature, but it is rare and high-speed mostly. Printed electronics is for, well, printed electronics. and flex is for flex and regid-flex board.
To be fast:
All tracks made of copper, you can use stanalone copper foil. Core - are redid dielectric it is has copper foil on it most of times. Prepregs are working like semi-flex glue.
Planes are inverted (negative) layers (what you draw there will be places without copper) used mostly for GND and power.
for power boards you need to be more specific and i suggest starting new thread for it. Cuz results may vary depending on your circuit.