Hi Furkan,
Via stitching is used to tie together larger copper areas on different layers, creating a low impedance and short return loops.
Eg: 1) Stitching ground pour between layers using vias.
2) To carry excessive currents, multiple copper area/polygon can be overlapped on different layers and tied together with via stitching.
Constrains and via parameters can be defined before stitching nets together.
Via shielding on the other hand is mostly related to RF designs. Track carrying RF signals can transmit EMI and is mitigated by isolating it with ground vias along the track. This might help:
https://www.digikey.com/en/articles/...g-interferenceKeepout layer is just a layer where you can define areas/regions using 'fill keep out' and the software won't let you route signals or place vias/ parts in that specified area. This void/barrier will be common to all the other signals and plane layers.
Fill Keepout can be used to define a void or a barrier region. It could also be placed on any signal/plane region to take effect only on that specific layer.
I suggest you work on a dummy board and start experimenting with different tools, good luck.
Nitin