robertferanec , 07-06-2020, 08:20 AM
That is a big topic.
But basically, this is what I normally do:
1) powers + grounds + decoupling capacitors
2) memory interface
3) differential pairs and other high speed signals
4) rest of the signals
How exactly to fanout a BGA, it depends on the technology what you can use (e.g. through hole vias only, uVIAs, vias in pad, how many layers, etc), it depends on BGA pitch, ... a lot of factors. It is not som simple to answer.
But, the best is to have a look at reference design and see how they did it.