Hi,
I'm working on a custom carrier board for the FPGA (PicoZed). On this board I have to route LVDS signals. There are four differential pair groups (buses) which I have to length match. Also I have to length match within each pair. Maximum operating frequency for the signals is going to be 250MHz. I have a couple of questions regarding all this.
My questions are following:
1. What is acceptable tolerance for length matching or how to deduce this? Currently I just picked 5mil for both (within and across pairs) which I think should be enough, but maybe it's too tight of a tolerance and just unnecessarely complicates things?
2. As the frequency is 250MHz (wavelength is little more than a meters), the transmission line should be regarded as short, so I think impedance matching should not be so strict of a requirement? I'm still trying to keep the diff pairs impedance 100ohms (both ends are terminated with this), but I mean, if I have to choose between length matching and impedance matching I think I should firstly worry about length matching and them impedance matching? Is my understanding correct? I've attached a picture that show some extreme examples of my diff pairs routing, are these okay or should I worry about signal integrity?
3. When doing impedance matching, I need to properly define layer stack-up and then define constraints (width, spacing) for my traces. I've used Saturn tool for that, but the problem is that I have to calculate impedance for the diff pairs on internal layers which have asymmetric dielectric heights. Inserting different heights is allowed, but how to account for the changing dielectric constant. Manufacturing house will manufacture the board using cores and prepregs alternately which have different dielectric constant values. For example PCBWay stack-up examples -
https://www.pcbway.com/blog/Engineer...___pcbway.html