FEDEVEL
Platform forum

Astral Master , 11-20-2025, 05:42 PM

4 layer board
RF network on layer 4 (BOTTOM LAYER)
Power trace on layer 1 (TOP LAYER)
Power trace outlined in white
also on a side note... How are my vias looking? The RF Vias and the general stitching Vias.

QDrives , 11-20-2025, 10:07 PM

Power trace is no problem.
Vias are:
- place them closer to the components of the RF network components.
- Why 2 sizes?
- Hole to hole clearance?
Get rud of the silk screen. Especially around the RF network.

Astral Master , 11-21-2025, 07:21 PM

They are already pretty close, do i really need them closer? And the hole to hole clearance is .750mm 2 sizes is becuase the big vias are more like general stitching vias and the small one 0.45 x 0.20 are so i can cram them in

QDrives , 11-21-2025, 08:00 PM

Close? No. See screenshot.
You would want either via in pad (more costly), or have just enough for a solder mask dam in between.

Astral Master , 11-21-2025, 10:51 PM

Ok got it i see what you mean