FEDEVEL
Platform forum

Bitu , 01-14-2025, 06:07 PM

I am working on a BGA package, and I am unsure about the size of the vias that should be placed between the BGA pads. The size of the solder pad is 0.28 mm. What should the via size be?

QDrives , 01-14-2025, 08:56 PM

You need to specify a lot more than just the size of the pads.
Pitch?
SMD/NSMD?
HDI? Blind/buried vias? Or just through hole?

Bitu , 01-15-2025, 04:18 AM

Pad size 0.28mm
Pitch 0.5mm
SMD
Via typ through hole

QDrives , 01-15-2025, 05:30 AM

A 0.5mm pitch is probably not SMD, but NSMD. Do note that it stands for Non Solder Mask Defined.

Bitu , 01-15-2025, 02:11 PM

Bitu , 01-15-2025, 02:22 PM

This is data sheet please guide me for this

QDrives , 01-15-2025, 04:37 PM

Let us assume that the smallest finished hole size is 0.1mm.
The fabricator uses a tool (drill) that is 0.1mm bigger. That makes the hole 0.2mm.
Annular ring of 0.1mm makes the pad 0.4mm.
Can you make all your connections using those vias?

Then there are the filled and capped vias so you can do "via-in-pad" a create a dog-bone shape.

If you still cannot make it, there are the microvias.