QDrives , 01-17-2024, 09:57 PM
The IPC performance classes specify minimum elements of vias, such as drill ratio, annular ring, etc.However, the performance class is something else than the density. The performance does add requirements to the footprint too.Check out this video https://www.youtube.com/watch?v=cMxXea16Hxc"Still be ok" -- Ok to what extend? I mentioned 3 issues with vias 'toughing' SMD pads. It is not a question of "fail" or "no problem", there is a chance production (and run-time) problems occur.How bad the problems will be depends on your design, what modifications the fabricator does to it and the modifications and process adjustments the assembly company makes.One way to solve your problem would be to fill the via and plate over it (VIPPO, Via In Pad Plated Over), but you already mention not to want that.But you also have not answered the question if you mean Type 3B vias.